Sharp Zenigata LED Reverse Costing Report
Physical Analysis of the Device Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price Recently publish is the reverse costing report of the GW5BTF27K00 Warm White LED supplied by Sharp.While using compact fluorescent light bulbs energy saving light helps conserve energy, it is important that the bulbs are collected and recycled properly to protect our environment Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.
The GW5BTF27K00 has a maximum brightness of 355lm at 700mA with a consumption of 6.7W.Light up the architecturally table lamps interesting parts of your home.
The module is provided in a specific 2-pins package integrating multiple LED chips using COB.sale of LED for lighting applications. Semileds is led lights only a minor palyer and should currently not be mentioned in the same breath as the other others
It can be used in a wide range of lighting applications, including commercial/residential directional lighting, general indoor/outdoor illumination, LED retrofit bulbs, spotlight, road lighting This report provides complete teardown of the LED with: - Detailed photos - Material analysis - Schematic assembly description - Manufacturing Process Flow - In-depth economical analysis - Manufacturing cost breakdown - Selling price estimation Key Topics Covered: Glossary 1.It was quick and light when I used dsttマジコン on a Windows 7 laptop, and gave me no trouble throughout a day of rigorous testing. Overview / Introduction - Executive Summary - Comparison of the Analyzed LEDs - Reverse Costing Methodology - GW5BTF27K00 2.The brightness of the LED makes sharp led lamp black & white contrasts between the areas in and out of the LED light. Physical Analysis - About the Physical Analysis - Physical Analysis Methodology - Package Characteristics - Package X-Ray - Package Connection - Dam and Fill - Phosphor - LEDs in the package - Package synthesis - Semiconductor Die - Patterned Sapphire Substrate - Epitaxial Structure - Structure - Passivation - Cathode - Anode - Active Layers - GaN die - Blue LED Structure 3. Manufacturing Process Flow - LED Die Process Flow - Description of the Wafer Fabrication Units 4. Cost Analysis - Synthesis of the Cost Analysis - Yields Explanation - Yield Hypotheses - LED Front-End Cost - Front-End : Epitaxy Hypotheses - Front-End : Epitaxy Cost - Front-End : Epitaxy Cost per Steps - Front-End : Other Front-End Cost - Front-End : Other Front-End Cost per Steps - Front-End Cost per Equipment Family - Front-End Cost per Consumable Family - Dies per Wafer & Probe Test - Back-End 0 : Probe Cost - Back-End 0 : Dicing Cost - LED Wafer & Die Cost (FE + BE 0) - Back-End 1 : Packaging Hypothesis - Back-End 1 : Packaging Process Flow - Back-End 1 : Packaging Cost Details - Back-End 1 : Final Test Cost - Component Manufacturing Cost (FE+BE0+BE1) - Cost Analysis Evolution 5. Estimated Manufacturer Price Analysis - Price definitions - Manufacturers financial ratios - Binning Impact on Manufacturing Price - Ideal manufacturer Price - Manufacturing Price with Binning Yield Conclusion For more information visit http://www.researchandmarkets.com/research/d63db3/sharp_zenigata_led CONTACT: Research and Markets Laura Wood, Senior Manager, press@researchandmarkets.com U.S. Fax: 646-607-1907 Fax (outside U.S.): +353-1-481-1716 ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties.
Physical Analysis of the Device Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price Recently publish is the reverse costing report of the GW5BTF27K00 Warm White LED supplied by Sharp.While using compact fluorescent light bulbs energy saving light helps conserve energy, it is important that the bulbs are collected and recycled properly to protect our environment Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.
The GW5BTF27K00 has a maximum brightness of 355lm at 700mA with a consumption of 6.7W.Light up the architecturally table lamps interesting parts of your home.
The module is provided in a specific 2-pins package integrating multiple LED chips using COB.sale of LED for lighting applications. Semileds is led lights only a minor palyer and should currently not be mentioned in the same breath as the other others
It can be used in a wide range of lighting applications, including commercial/residential directional lighting, general indoor/outdoor illumination, LED retrofit bulbs, spotlight, road lighting This report provides complete teardown of the LED with: - Detailed photos - Material analysis - Schematic assembly description - Manufacturing Process Flow - In-depth economical analysis - Manufacturing cost breakdown - Selling price estimation Key Topics Covered: Glossary 1.It was quick and light when I used dsttマジコン on a Windows 7 laptop, and gave me no trouble throughout a day of rigorous testing. Overview / Introduction - Executive Summary - Comparison of the Analyzed LEDs - Reverse Costing Methodology - GW5BTF27K00 2.The brightness of the LED makes sharp led lamp black & white contrasts between the areas in and out of the LED light. Physical Analysis - About the Physical Analysis - Physical Analysis Methodology - Package Characteristics - Package X-Ray - Package Connection - Dam and Fill - Phosphor - LEDs in the package - Package synthesis - Semiconductor Die - Patterned Sapphire Substrate - Epitaxial Structure - Structure - Passivation - Cathode - Anode - Active Layers - GaN die - Blue LED Structure 3. Manufacturing Process Flow - LED Die Process Flow - Description of the Wafer Fabrication Units 4. Cost Analysis - Synthesis of the Cost Analysis - Yields Explanation - Yield Hypotheses - LED Front-End Cost - Front-End : Epitaxy Hypotheses - Front-End : Epitaxy Cost - Front-End : Epitaxy Cost per Steps - Front-End : Other Front-End Cost - Front-End : Other Front-End Cost per Steps - Front-End Cost per Equipment Family - Front-End Cost per Consumable Family - Dies per Wafer & Probe Test - Back-End 0 : Probe Cost - Back-End 0 : Dicing Cost - LED Wafer & Die Cost (FE + BE 0) - Back-End 1 : Packaging Hypothesis - Back-End 1 : Packaging Process Flow - Back-End 1 : Packaging Cost Details - Back-End 1 : Final Test Cost - Component Manufacturing Cost (FE+BE0+BE1) - Cost Analysis Evolution 5. Estimated Manufacturer Price Analysis - Price definitions - Manufacturers financial ratios - Binning Impact on Manufacturing Price - Ideal manufacturer Price - Manufacturing Price with Binning Yield Conclusion For more information visit http://www.researchandmarkets.com/research/d63db3/sharp_zenigata_led CONTACT: Research and Markets Laura Wood, Senior Manager, press@researchandmarkets.com U.S. Fax: 646-607-1907 Fax (outside U.S.): +353-1-481-1716 ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties.
沒有留言:
張貼留言